Tokyo, Japan (February 5, 2004) -- Morrison & Foerster has advised Sony Computer Entertainment Inc. in connection with its $325 million (¥36 billion) investment in IBM Corporation's Fishkill, New York, semiconductor plant, at which IBM will manufacture for Sony Group new chips for the broadband-era, codenamed "Cell", as well as various media processors to be used for a wide array of Sony Group's next generation digital consumer electronics products and next generation computer entertainment system. The chips produced at IBM's Fishkill facility will be the first IBM chips to be made on 300 mm silicon wafers, and will be built using the advanced 65 nanometer process.

The investment by Sony is part of a three-pronged investment, in which Sony is also investing in 65 nanometer process on 300 mm wafer fabrication lines at Sony Computer Entertainment Inc.'s Nagasaki Prefecture facility and Toshiba Corporation's new Oita Prefecture facility. Sony's total investment in all three facilities is approximately 1.14 billion (¥120 billion).

The MoFo team was led by partner Wayne Pittaway in Tokyo.